NTB6411AN, NTP6411AN, NVB6411AN
8000
7000
6000
5000
4000
C iss
T J = 25 ° C
V GS = 0 V
10
8
6
V DS
Q gs
Q gd
Q T
V GS
100
80
60
3000
4
40
2000
1000
0
C rss
0
C oss
10 20 30 40 50 60 70 80 90
100
2
0
0
V DS = 80 V
I D = 72 A
T J = 25 ° C
20 40 60 80
20
0
100
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
Q g , TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source Voltage and
Drain ? to ? Source Voltage versus Total Charge
1000
100
V DS = 80 V
I D = 72 A
V GS = 10 V
t r
t f
t d(off)
80
70
60
50
T J = 25 ° C
V GS = 0 V
40
10
t d(on)
30
20
10
1
1
10
100
0
0.4
0.5 0.6 0.7 0.8 0.9
1.0
1000
R G , GATE RESISTANCE ( W )
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
500
V SD , SOURCE ? TO ? DRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage versus
Current
I D = 56 A
100
10
10 m s
100 m s
1 ms
400
300
1
V GS = 10 V
SINGLE PULSE
T C = 25 ° C
R DS(on) LIMIT
THERMAL LIMIT
10 ms
dc
200
100
0.1
1
PACKAGE LIMIT
10 100
1000
0
25
50 75 100 125 150
175
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
T J , STARTING JUNCTION TEMPERATURE
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
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